4 Layers With 300um Copper
Application : High Power
| Product Specifications | |
|---|---|
| Layer Count | 4 Layers |
| Material | FR4 Mid Tg |
| Board Thickness | 59mil |
| Line width spacing | 6 mil / 6mil |
| Copper thickness | 35um embedded 300um copper shape |
| Special Design | Built in Copper Shape (300um) for high power application under reasonable cost. |
